Apparatus and method for an embedded air dielectric for a package and a printed circuit board
US7361842B2 · kind B2 · utility
6Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2005 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Dec 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method, apparatus, and system for a printed circuit board (PCB) and package with an embedded air dielectric includes a conductor formed on a surface of a first core layer, a conductor layer overlaying an inner surface of a cavity formed in a second core layer, the conductor layer opposing the conductor, and a sealed air channel between and separating the conductor and the conductor layer from contacting each other. A gas in the sealed air channel provides a primary dielectric therein. The gas may be air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.