Heater for heating a wafer and method for fabricating the same
US7361865B2 · kind B2 · utility
143Cited by
1References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2005 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | May 25, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/143
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Provided is a heater capable of having a high uniform heating characteristic and substantially equally heating a wafer etc. mounted thereon, and a wafer heating device using the same, as well as a method thereof. The heater comprises a plate shaped body, a belt-like resistance heating element formed on the plate shaped body and having a channel for adjusting the resistance value, and a positioning mark formed on the plate shaped body, which serves as a reference for positioning the channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.