“I” beam bridge interconnection for ultra-sensitive silicon sensor
US7361900B2 · kind B2 · utility
1Cited by
5References
19Claims
0Family size
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Key dates
| Filing date | Dec 14, 2005 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Feb 16, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01J5/20
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A bolometer type focal plane is made up of a plurality of silicon sensors. Within each sensor, interconnection between co-planar stages is provided by elongated “I” beam type bridge members having a generally rectangular cross-section including unequal wider (height) and narrower (width) dimensions, and wherein the bridge members are oriented such that the narrower width dimension is in the direction of the common plane and the wider height dimension is perpendicular to the common plane. A sensor with these bridges accommodates stress/strain by rotation while preventing out-of-plane deflection and deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.