Leadframe and packaged light emitting diode
US7361940B2 · kind B2 · utility
43Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 8, 2005 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Jul 8, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.