Head stack assembly and manufacturing method thereof, and disk drive unit using the same
US7362545B2 · kind B2 · utility
1Cited by
7References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2004 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Feb 10, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10234
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Connecting a head gimbal assembly with a controlling circuit, including the steps of facing connecting terminals of the head gimbal assembly and the connecting terminal of the controlling circuit to contact with each other and fastening the head gimbal assembly with the controlling circuit to maintain a touch connection of the terminals thereof.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.