Heat dissipation device
US7362573B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Apr 28, 2006 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Jun 14, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink having a heat conducting core and a plurality of fins extending from the core. The core has a downward extension portion extending away the fins for contacting a heat generating device. A locking device includes a locking plate defining a central opening accommodating the extension portion of the core of the heat sink therein and has a plurality of locking arms extending from the locking plate. Pluralities of cutouts circumferentially surrounding and communicating with the opening are defined in the locking plate. The extension portion of the core of the heat sink is punched to press the locking plate of the locking device toward the heat sink and have portions thereof engaged in the cutouts of the locking plate of the locking device, whereby the locking device is stably fixed to the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.