Heat relief socket
US7362584B2 · kind B2 · utility
1Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 7, 2006 |
| Grant date | Apr 22, 2008 |
| Priority date | — |
| Expiry date | Jun 1, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat relief socket is provided where a contact carrier substrate is provided carrying a plurality of contacts, and is supported by a frame. The frame has an open area therethrough which can receive air flow to cool the bottom of a chip carried by the socket and the contacts themselves.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.