High-pressure sensor housing which is simplified by means of a connection element (also emc)
US7363819B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2003 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jan 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/14
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device for measuring pressure, in particular for measuring high pressure, is provided, having a pressure sensor situated in a sensor housing, the sensor housing having a first sensor housing part provided with a pressure connecting piece and a second sensor housing part provided with an electric terminal. To reduce the manufacturing cost, the second sensor housing part is attached to the first sensor housing part by a connecting part situated between the first sensor housing part and the second sensor housing part, it being possible for the connecting part to be manufactured as a simple punch bent part or thin-walled tubular part, for example.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.