Patent · US Expired

High-pressure sensor housing which is simplified by means of a connection element (also emc)

US7363819B2 · kind B2 · utility

8Cited by
14References
11Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 18, 2003
Grant dateApr 29, 2008
Priority date
Expiry dateJan 22, 2024

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01L19/14
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A device for measuring pressure, in particular for measuring high pressure, is provided, having a pressure sensor situated in a sensor housing, the sensor housing having a first sensor housing part provided with a pressure connecting piece and a second sensor housing part provided with an electric terminal. To reduce the manufacturing cost, the second sensor housing part is attached to the first sensor housing part by a connecting part situated between the first sensor housing part and the second sensor housing part, it being possible for the connecting part to be manufactured as a simple punch bent part or thin-walled tubular part, for example.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.