Heat sink
US7363964B2 · kind B2 · utility
3Cited by
4References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2006 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jun 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink includes a base, a set of fins mounted to the base and a plurality of fixing portions, wherein the fixing portions extend from a surface of the base and the set of fins are mounted on an opposite surface of the base. The heat sink is secured to a printed circuit board with at least one heat generating component through the fixing portion of the base. The heat sink is improved by forming one or more slots at lateral sides of the base such that one or more deformable portions can be defined on the base. Thus, the deformable length of the base is increased and the heat stress is relaxed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.