Thermally coupling an integrated heat spreader to a heat sink base
US7364063B2 · kind B2 · utility
16Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 2004 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Aug 5, 2025 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.