Mold-spraying apparatus of molding system
US7364419B2 · kind B2 · utility
1Cited by
7References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2007 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Mar 23, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S264/72
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Disclosed is: (i) a mold-spraying apparatus of a molding system and/or (ii) a molding system having a mold-spraying apparatus, and/or (iii) a method of a mold spraying apparatus of a molding system, and/or (vi) a method of a molding system having a mold-spraying apparatus, amongst other things.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.