Integration area, system and method for providing interconnections among components
US7364455B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2006 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Oct 16, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/24
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The integration areas, system and method of interconnecting components provide efficient techniques for separating the conductive path between components from the pin-to-pin integration between components through the use of conductive elements that may be interconnected in a variety of manners. The interconnections between the conductive elements may be configured automatically and may be modified relatively easily. The integration area includes component connection receptacles, first conductive elements that extend from each component connection receptacle, second conductive elements that extend across at least one first conductive element, and connections between the conductive elements to interconnect the components. The conductive elements may include flatwire segments and/or printed circuit boards. The connections between the conductive elements may be made with pins and jumpers, connection vias and solder patches and/or various insulation barriers through which the conductive elements connect.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.