Wafer handling apparatus and method of manufacturing thereof
US7364624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2004 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Apr 16, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/143
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A wafer processing device or apparatus, i.e., a heater or an electrostatic chuck, comprises a planar support platen, a support shaft having centrally located bore, and a pair of electrical conductors located in the shaft. In one embodiment, the electrical conductors are concentrically located within the bore of the shaft, with the first electrical lead being in the form of a pyrolytic graphite rod and separated from the outer second graphite electrical lead by means of a pyrolytic boron nitride (pBN) coating. In a second embodiment, the support platen and the support shaft are formed from a single unitary body of graphite. In yet another embodiment of the device of the invention, the connection posts comprise a carbon fiber composite and the exposed ends of the electrical connectors are coated with a protective ceramic paste for extended life in operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.