Multi-level semiconductor module and method for fabricating the same
US7365416B2 · kind B2 · utility
128Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 5, 2005 |
| Grant date | Apr 29, 2008 |
| Priority date | — |
| Expiry date | Jul 31, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module is formed by alternately stacking resin boards 3 on which semiconductor chips 2 are mounted and sheet members having openings larger than the semiconductor chips 2 and bonded to the resin boards 3. The resin board 4 located at the bottom out of the resin boards 3 is thicker than the other resin boards 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.