Method for forming metal wires by microdispensing pattern
US7367118B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2004 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Nov 5, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a metal wire by microdispensing a pattern is provided. In the method, a substrate has been treated by SAM is firstly provided. Then, a catalytic agent is microdispensed on the surface of the substrate at places for forming a metal wire, and a catalytic pattern is rendered. Next, a metal wire on the catalytic pattern by an electroless plating process is formed, and a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing is provided. In addition, the vibration is generated by an apparatus which includes forming a metal wire on the catalytic pattern by an electroless plating process, and providing a vibration in a period of ink-jet discharging and ink drying during the step of microdispensing, wherein the vibration is generated by an apparatus which includes a supportive frame and a vibration generation module.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.