Medium containing optical paths and electrically conducting paths for applications in high speed data links
US7367715B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2007 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Mar 22, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0274
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A structure that possesses the combined properties of carrying signals through the provision of a series of electrical conductors, and by optical signals through the intermediary of a series of optical waveguides. This imparts a particular advantage thereto for the fabrication of optical data links, providing a convenient, compact method of interconnecting electrical paths to transducer chips and to waveguide structures. This approach solves the problem of connecting polymer waveguides to VCSEL (Vertical-Cavity-Surface-Emitting Laser) arrays, thereby avoiding the problem of damaging fragile wire bonds. A method is also provided which utilizes the foregoing structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.