RFID label technique
US7368032B2 · kind B2 · utility
38Cited by
142References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2006 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | May 16, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1097
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An RFID webstock containing a relatively high pitch-density array of semiconductive chips is provided and joined to a web bearing relatively widely spaced antennas in a continuous process. The RFID webstock is separated or cut into individual chip sections, with the spacing of the chips being increased as the RFID webstock is die cut. The individual chips on the sections are then joined to corresponding antennas to form an RFID inlay stock. This process is conducive to high speed roll-to-roll production of RFID tag and label roll stock.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.