High aspect ratio micromechanical probe tips and methods of fabrication
US7368305B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 10, 2005 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Dec 14, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24521
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of fabricating high aspect ratio micromechanical tips is provided. The method includes, but is not limited to, forming an etchant protective island on a surface of a silicon substrate with the silicon substrate exposed around the island; isotropically etching the silicon substrate by reactive ion etching around the protective island to partially undercut the silicon substrate beneath the protective island; anisotropically etching, by deep reactive ion etching, the silicon surrounding the island to a desired depth to define a tip shaft of the desired height supported at a base by the substrate; removing the protective island from the tip; and sharpening the top of the tip shaft to an apex. Using the method, micromechanical tips having heights greater than at least 30 μm have been obtained while maintaining the vertical sidewall necessary for both AFM and scanning near-field microwave microscopy (SNMM) profiling applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.