Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules
US7368311B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2004 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Jul 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H59/0009
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect module and a method of manufacturing the same. The method of making an interconnect module on a substrate comprises forming an interconnect section on the substrate. The interconnect section comprises at least two metal interconnect layers separated by a dielectric layer. The method further comprises forming a passive device on the substrate at a location laterally adjacent to the interconnect section. The passive device comprises at least one moveable element comprising a metal layer. The method further comprises forming the metal layer and one of the at least two metal interconnect layers from substantially the same material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.