Electrically conductive matching layers and methods
US7368852B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2003 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Nov 11, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24612
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Matching layers are provided, including: electrically conductive acoustic matching layers, methods for conducting electric current through matching layers, methods for manufacturing multi-dimensional arrays using conductive matching layers, and multi-dimensional arrays with electrically conducting matching layers. Matching layers with conductors aligned for providing electrical conduction through the thickness or range dimension of the matching layer are provided. For example, vias, aligned magnetic particles, or conductive films at least partially or entirely within the matching layer of each element allow electrical conduction from the transducer material to a ground foil or flex circuit. By using multiple electrical conductive matching layers, a gradation in acoustic impedance for better matching is provided while allowing dicing of the entire stack, including the matching layers and the electroceramic material, in one step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.