Inductor element containing circuit board and power amplifier module
US7368998B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2006 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Dec 8, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0542
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An inductor element containing circuit board of the present invention comprises a plurality of conductive layers, and a conductor having an inductor function (inductor conductor segment) in one or more of the conductive layers, wherein at least part of the inductor conductor segment is made thicker than other conductors disposed within the circuit board. The at least part of the inductor conductor segment extends through an insulating layer disposed between the conductive layers, or is embedded in the insulating layer, wherein the part of the inductor conductor segment has a thickness one-half or more the thickness of the insulating layer. A power amplifier module of the present invention comprises the multi-layer circuit board, a semiconductor amplifier fabricated in the multi-layer circuit board, and an impedance matching circuit coupled to the output of the semiconductor amplifier. The impedance matching circuit has a portion thereof formed of the inductor conductor segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.