Ball Grid Array package having integrated antenna pad
US7369090B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 4, 2004 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Mar 22, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3436
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for an improved Ball Grid Array (BGA) package includes a semiconductor device having a radio frequency (RF) input or output, an antenna pad, and a BGA package structured to house the semiconductor device and the antenna pad. The antenna pad may be coupled to the radio frequency (RF) input or output, and the antenna pad is structured to reduce the inductance of the BGA package. The antenna pad may include a pad disposed above the semiconductor device, a pad disposed to the side of the semiconductor device, or an antenna chip. An antenna may be coupled to the antenna pad. The antenna may include a trace antenna, a staggered antenna, or a helical antenna.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.