Electrostatic chucks having barrier layer
US7369393B2 · kind B2 · utility
6Cited by
8References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2005 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Dec 30, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/166
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck for supporting a semiconductor wafer, including: a chuck body having a dielectric region and an insulating region, the insulating region having a higher electrical resistivity than the dielectric region, an electrode embedded in the chuck body, and a barrier layer provided between dielectric region and the insulating region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.