Optical communication between face-to-face semiconductor chips
US7369726B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 2, 2004 |
| Grant date | May 6, 2008 |
| Priority date | — |
| Expiry date | Nov 29, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
One embodiment of the present invention provides a system that communicates between a first semiconductor die and a second semiconductor die through optical signaling. During operation, the system converts an electrical signal into an optical signal using an electrical-to-optical transducer located on a face of the first semiconductor die, wherein the first semiconductor die and the second semiconductor die are oriented face-to-face so that the optical signal generated on the first semiconductor die shines on the second semiconductor die. Upon receiving the optical signal on a face of the second semiconductor die, the system converts the optical signal into a corresponding electrical signal using an optical-to-electrical transducer located on the face of the second semiconductor die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.