Wiring repair apparatus
US7371286B2 · kind B2 · utility
1Cited by
5References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 15, 2004 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Sep 15, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wiring repair apparatus includes an XY stage on which a substrate is placed, a laser source unit disposed above the XY stage, first and second gas windows disposed between the laser source unit and the XY stage, and first and second CVD gas units. The laser source unit emits a laser beam to a part of the substrate to be repaired. This laser beam passes through either the first or second gas window. The first CVD gas unit supplies an Al source gas (DMAH gas) to the first gas window while the second CVD gas unit supplies a Cr source gas (Cr(CO)6 gas) to the second gas window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.