Method and apparatus for bonding a wire
US7371675B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2004 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Oct 21, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/20753
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for bonding a wire and a wire bond device formed by the same are disclosed. The method includes providing a carrier with at least a first pad, providing a semiconductor chip having at least the second pad, the at least second pad being smaller than the first a pad, forming a conductive stud bump on the second pad, and forming a bonding wire that has two terminal portions, which are respectively bonded to the first pad and the stud bump to electrically connect the first pad and the second pad. The stud bump is bonded to the second pad by a ball bonding method which uses a wire that has an approximately smaller diameter than the bonding wire. Further, a prominence formed on one end of the terminal portions is provided which has an approximately larger diameter than the stud bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.