Semiconductor device and method of manufacturing semiconductor device
US7372167B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2005 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Oct 19, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to claim 1, wherein A method of manufacturing a semiconductor chip the carrier substrate A semiconductor device includes; a carrier substrate in which a semiconductor chip is mounted; a first land that is mounted on the carrier substrate and placed on a region which is differ from a region for mounting the semiconductor chip, and a basis metal of an junction surface of the first land is exposed; and a second land that is mounted on the carrier substrate and placed on a region which is differ from a region for mounting the semiconductor chip, and a plating layer is deposited on a junction surface of the second land.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.