Microswitch and method for manufacturing the same
US7372191B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 28, 2005 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Apr 11, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/2042
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A microswitch is provided with a movable electrode contact component including a bending displacement component having a cantilever shape, a piezoelectric/electrostrictive element having a piezoelectric/electrostrictor and a voltage application electrode layers, and a substrate joined to a support portion of the movable electrode contact component and having a fixed electrode disposed on the surface thereof, wherein the piezoelectric/electrostrictive element is driven to displace the movable electrode, so that the movable electrode and the fixed electrode can be brought into a state of being electrically connected to each other or disconnected from each other. At least a thin plate of the bending displacement component is made of a ceramic material, and the thin plate, the piezoelectric/electrostrictor, and the voltage application electrode layers are integrated by firing. The microswitch can efficiently switch high-frequency signals at low power consumption and has excellent responsiveness, excellent durability, and high reliability of long term driving.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.