Hidden hinge MEMS device
US7372617B2 · kind B2 · utility
0Cited by
6References
13Claims
0Family size
Inventors
Key dates
| Filing date | Jul 6, 2005 |
| Grant date | May 13, 2008 |
| Priority date | — |
| Expiry date | Jul 6, 2025 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B26/0841
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The present invention relates to a method for manufacturing a MEMS device, including the actions of: providing a substrate having a back and front surface essentially in parallel with each other, defining in said substrate at least one hidden support by removing material from said substrate, connecting said at least one hidden support onto a wafer with at least one actuation electrode capable to actuate at least a part of said substrate, wherein a rotational axis of said reflective surface is essentially perpendicular to said hidden support. The invention also relates to the MEMS as such.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.