Mounting components to a hardware casing
US7375278B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2006 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Mar 8, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods, systems, and media to mount one or more components to a hardware casing are disclosed. Embodiments include hardware and/or software for determining a pattern of interconnects to apply to an interior surface of the hardware casing. The pattern includes at least one independent path for transmitting a signal between the components. The pattern of interconnects is then applied to the interior surface, the application being configured for the topography of the interior surface to couple the components with the pattern of interconnects. In many embodiments, the components may then be mounted to the casing and interconnected with the interconnects. And, in some embodiments the pattern of interconnects may be coupled with a circuit board having additional components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.