Printed circuit board and manufacturing method thereof
US7375286B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2007 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Mar 21, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A plurality of wiring patterns in a stripe form are formed to be parallel to one another on one surface of a base insulating layer. The wiring patterns each have a layered structure including a conductive layer and a wiring layer. A thin metal film is formed on the other surface of the base insulating layer, and a plurality of ground patterns in a stripe form are formed to be parallel to one another on the thin metal film. The wiring patterns and the ground patterns are provided in a staggered manner so that they are not opposed to one another with the base insulating layer interposed therebetween. In other words, the ground patterns are provided to be opposed to regions between the wiring patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.