Printed circuit board via with radio frequency absorber
US7375290B1 · kind B1 · utility
Inventors
Key dates
| Filing date | Oct 11, 2006 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Dec 2, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board with vias that reduce or eliminate radio frequency interference and method of forming the same. The printed circuit board includes non-conductive layers, conductive-layers interspersed between the non-conductive layers, vias extending through the non-conductive layers and the conductive layers, radio frequency absorbing material within each of the vias, where the radio frequency absorbing material is at a conductive layer within the printed circuit board at which a conductive trace is not connected to a via, an insulating layer over each radio frequency absorbing material, and a cylindrical conductive material within via and over each insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.