Clip and heat dissipation assembly using the same
US7375965B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 1, 2006 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Oct 14, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44017
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly comprises a mounting seat, a heat sink and a clip for fastening the heat sink in the mounting seat. The mounting seat defines an opening and is provided with a first and second protrusions. The heat sink is accommodated in the opening of the mounting seat. The clip comprises an elongated pressing member for pressing the heat sink and a clamping leg connected to one end of the pressing member and attached to the first protrusion of the mounting seat. An operating member, defining a notch, is pivotably attached to the other end of the pressing member and is rotatable relative to the pressing member and the second protrusion of the mounting seat slides in the notch of the operating member so that the clip switches between a release status and locking status.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.