Method and apparatus for routing a differential pair on a printed circuit board
US7375979B2 · kind B2 · utility
0Cited by
8References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2005 |
| Grant date | May 20, 2008 |
| Priority date | — |
| Expiry date | Jan 29, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/097
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A differential pair (200) is provided by routing a printed circuit board (202) having high density interconnect (HDI) substrate (204) with first and second metal layers (212, 218) such that a first runner (206) forms a zigzag pattern using the two metal layers while a second runner (208) forms a second zigzag pattern on the same two metal layers. The first and second zigzag patterns overlap so as to provide orthogonal signal flow.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.