Method and device for drying substrate
US7377053B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 17, 2000 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Jan 17, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device for drying substrate comprising a processing vessel housing a specified number of substrates such as semiconductor wafers installed erectedly in parallel to one another, a first substrate supporting member supporting substrates within the processing vessel, the processing fluid supplying section supplying to the processing vessel, the processing fluid for performing processing such as cleaning processing on the substrates, a processing fluid exhausting section exhausting processing fluid from the processing vessel, and a drying fluid supplying section supplying, to the processing vessel, the liquid drops of drying fluid for performing drying processing on the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.