Process for securing a microwave module to a support
US7377990B2 · kind B2 · utility
0Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2001 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Nov 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1092
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to a process for securing to a metal support at least one microwave electronic module made on a substrate one of whose faces forms an earth plane. The process consists in depositing between the face forming the earth plane and the metal support, at least one strip of conducting adhesive at the level of the zones of breakage of the earth plane. The invention applies to the microwave field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.