Photoresist resin composition
US7378223B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 6, 2005 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Jun 9, 2026 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/125
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The invention provides photoresist resin compositions and in particular, a photoresist resin compositions comprising a) an acrylate monomer having two urethane bonds, b) a crosslinkable urethane monomer having at least two ethylene double bonds, c) an alkali-soluble compound, d) a photopolymerization initiator and e) a solvent, and a photoresist dry film resists using the photoresist resins. The photoresist resin compositions and the photoresist dry film resists using the same in accordance with the invention have excellent adhesion to a substrate and sandblast resistance and at the same time, they have high sensitivity as well as high resolution, thereby enabling fine pattern formation on substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.