No VOC radiation curable resin compositions with enhanced flexibility
US7378457B2 · kind B2 · utility
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33References
102Claims
0Family size
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Key dates
| Filing date | Mar 9, 2005 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Mar 9, 2025 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D175/16
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides radiation curable resin compositions having enhanced low temperature flexibility and to methods of using these compositions. The radiation curable resin compositions contain no or essentially no volatile organic components (VOCs), and find particular use as coating compositions. In particular, the radiation curable resin compositions of this invention comprise a vinyl dioxolane end-capped oligomer blended with a photoinitiator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.