Hot Melt Adhesives
US7378481B1 · kind B1 · utility
14Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2007 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Feb 8, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S526/943
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot melt adhesive based on a functionalized metallocene polyethylene copolymer finds use in packaging applications where high heat resistance, as well as good cold tolerance, is required.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.