Shielding assembly for a semiconductor manufacturing apparatus and method of using the same
US7378670B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2002 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Mar 17, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31701
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A shielding assembly for use in a semiconductor manufacturing apparatus, such as an ion implantation apparatus, includes one or more removable shielding members configured to cover inner surfaces of a mass analyzing chamber. The shielding assembly reduces process by-products from accumulating on the inner surfaces. In one embodiment, a shielding assembly includes first and second shielding members, each having a unitary construction and configured to cover a magnetic area in the mass analyzing chamber. The shielding members desirably are made entirely of graphite or impregnated graphite to minimize contamination of the semiconductor device being processed caused by metal particles eroded from the inner surfaces of the mass analyzing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.