Probing high-frequency signals
US7378832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2006 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Aug 22, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/06772
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Apparatus and associated systems and methods may relate to a wide bandwidth cable assembly that may include an active amplification stage to receive high frequency signals (e.g., 1 GHz or above) through a transmission line extending distally to a passive, high density signal probe stage. In an illustrative example, the probe stage may receive multiple analog or digital signals from a device under test (DUT). In some embodiments, the probe stage may include probe pins with integrated series resistance to control signal loading, and an equalizer to shape the signal path's frequency response. The amplification stage may provide a virtual ground reference for a termination impedance that may match the transmission line's impedance and may connect in series with a feedback impedance. In one example, a minimally invasive probe head may facilitate measurement of multiple channels of a high speed data bus with minimal signal distortion and/or attenuation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.