Multilayer gimbal suspension element manufacture with co-etchable layers
US7379271B1 · kind B1 · utility
3Cited by
9References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2005 |
| Grant date | May 27, 2008 |
| Priority date | — |
| Expiry date | Aug 18, 2026 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/4826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Shaping of a gimbal suspension element for a disk drive suspension using fewer process steps includes disposing an element, precursor assembly of a plastic film layer and a copper layer with an interlayer of a copper seed layer and a Monel alloy for etching, and etching the assembly with an etchant such as cupric chloride for both the alloy and the copper seed layer of the interlayer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.