Method of connecting module layers suitable for the production of microstructure modules and a microstructure module

US7380698B2 · kind B2 · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Heinrich Meyer · Berlin, DE
• Konrad Cramer · Berlin, DE
• Olaf Kurtz · Berlin, DE
• Ralph Herber · Mainz, DE
• Wolfgang Friz · Göppingen, DE
• Carsten Schwiekendick · Berlin, DE
• Oliver Ringtunatus · Berlin, DE
• Christian Madry · Berlin, DE

Key dates

• Filing date: Mar 21, 2003
• Grant date: Jun 3, 2008
• Expiry date: Oct 4, 2024

Classification

• Technology area (CPC F): Mechanical Engineering; Lighting; Heating
• CPC primary: F28F2260/02
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A method for joining microstructured component layers and a method for manufacturing microstructure component layers and the microstructure component layer is provided. At least one multifunctional barrier coating is applied to the joining surfaces of a base material layer for the microstructured component layers. The layers are made of aluminum/aluminum alloys and/or copper/copper alloys, and/or noble steels. At least one solder/brazing coating is applied to each barrier coating. The coated base material layers comprising the component layers are stacked. The stacked component layers are joined by solder/brazing using heat. The melting temperature of the solder/brazing coating is higher after the heat joining than before same.