Patent · US Active

Fluid ejection assembly

US7380914B2 · kind B2 · utility

1Cited by

50References

22Claims

0Family size

Assignee

HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. · US

Inventors

Hector Lebron · San Diego, US
Paul Crivelli · San Diego, US
Scott W. Hock · San Diego, US

Key dates

Filing date	Apr 26, 2005
Grant date	Jun 3, 2008
Priority date	—
Expiry date	May 31, 2026

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB41J2002/14379
WIPO fieldTextile and paper machines
WIPO sectorMechanical engineering

Abstract

A fluid ejection assembly includes a first layer, and a second layer positioned on a side of the first layer. The second layer has a side adjacent the side of the first layer and includes barriers defining a fluid chamber on the side, a drop ejecting element formed within the fluid chamber, and a thermal conduction path extended between the fluid chamber and the barriers.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.