Method for reducing shrinkage during sintering low-temperature-cofired ceramics
US7381283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 21, 2004 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Jun 6, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/16
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention mainly relates to a method for reducing shrinkage during sintering low-temperature-cofired ceramics, the ceramics comprising a dielectric portion and a heterogeneous material portion, the method comprising the steps of: (a) providing a monolithic structure, the monolithic structure comprising a dielectric body and a constraining layer; the dielectric body comprising at least one dielectric layer that comprises at least one active area; wherein said active area is disposed with at least one heterogeneous material pattern; the constraining layer positioned on the top of the dielectric body comprising at least one window wherein the edge of the active area of the dielectric layer each falls within the edge of the window in the vertical direction; (b) firing the monolithic structure; and (c) singulating the monolithic structure along a cutting line to provide the low-temperature-cofired ceramics, wherein the cutting line is disposed in the area formed between the edge of the window and the edge of the active area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.