Manufacturing method of a device
US7381285B2 · kind B2 · utility
2Cited by
7References
20Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 14, 2005 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Apr 14, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
Abstract
In a manufacturing method of a flexible device, when a protective material is adhered onto a surface of a substrate, the adhesion is performed at only a part of the substrate. Since being adhered to the part of the substrate, the protective material is easily peeled away. As a result, the time required for peeling can be decreased, and cracking of the device which may occur in peeling can be prevented.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.