Method and apparatus for monitoring precision of water placement alignment
US7381576B2 · kind B2 · utility
1Cited by
6References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2005 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Apr 3, 2026 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for monitoring precision of placement of semiconductor wafers in a semiconductor processing apparatus includes measuring thickness of an insulating film on a surface of a semiconductor substrate before etching a portion of the insulating film from the surface of the semiconductor substrate. The method further includes re-measuring the thickness of the insulating film to determine etch rates for the film at selected locations on the surface of the semiconductor wafer, and based on the determined etch rates, determining misalignment of the semiconductor wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.