Stable aqueous slurry suspensions
US7381690B1 · kind B1 · utility
19Cited by
2References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2003 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Nov 5, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2050/015
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An aqueous slurry composition for lapping, saw wire cutting, and finishing operations which contains about 0.1 to 70% by weight of abrasive particles, 0.1 to 20% by weight of suspending particles that have a density of less than or similar to the aqueous or semi-aqueous carrier medium, and the method for creating the suspension.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.