Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof
US7382627B2 · kind B2 · utility
10Cited by
24References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 18, 2004 |
| Grant date | Jun 3, 2008 |
| Priority date | — |
| Expiry date | Jul 24, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A capacitive/resistive device provides both resistive and capacitive functions. The capacitive/resistive device may be embedded within a layer of a printed wiring board. Embedding the capacitive/resistive device conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability. Conserves board surface real estate, and reduces the number of solder connections, thereby increasing reliability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.