Security tag system for fabricating a tag including an integrated surface processing system
US7384496B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2004 |
| Grant date | Jun 10, 2008 |
| Priority date | — |
| Expiry date | Dec 15, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1097
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A method of fabricating a tag includes the steps of applying a first patterned adhesive to the surface of the substrate and applying a first electrically conductive foil to the first patterned adhesive. A portion of the first electrically conductive foil not adhered to the first patterned adhesive is removed and a second patterned adhesive is applied to a portion of a surface area of the tag. A preformed second electrically conductive foil is applied to the second patterned adhesive to adhere the second electrically conductive foil to the surface of the substrate and portions of the first and second electrically conductive foils are electrically coupled to each other to form a tag circuit. A second patterned adhesive can be disposed between the first and second electrically conductive foils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.